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TOPPAN Holdings Inc.

TOPPAN Holdings Inc. develops solutions based on its printing technologies in Japan, Asia, and internationally. It operates through three segments: Information & Communication, Lifestyle & Industry, and Electronics. The Information & Communication segment offers securities in general, bankbooks, cards, business forms, catalogs and other advertising and promotional printed materials, magazines, books, outsourcing, and other publications services. The Lifestyle & Industry segment provides soft packaging materials, paper containers and other packaging, plastic molded products, inks, transparent barrier films, decorative sheets, wallpaper, and other building materials. The Electronics segment offers LCD color filters, TFT LCDs, anti-reflection films, photomasks, and semiconductor package products. The company was formerly known as Toppan Inc. and changed its name to TOPPAN Holdings Inc. in October 2023. TOPPAN Holdings Inc. was founded in 1900 and is headquartered in Tokyo, Japan.

Price · split & dividend adjusted
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Kumamoto Magnitude 7 Quake Halts Semiconductor Plants, Companies Rush to Restore Operations

Following the earthquake that registered a maximum intensity of 7 in Kumamoto Prefecture, nearby semiconductor-related factories all halted operations simultaneously. Renesas Electronics has resumed production at its Nishiki plant, while the Kawashiri plant aims to restart by August 5. Mitsubishi Electric has partially resumed operations at two plants, Ebara Corporation has restarted its plant in Nankan Town, and Tokyo Electron indicated it expects to recover early next week. Meanwhile, Sony Group's image sensor plant in Kikuyo Town and Toppan Holdings' plant in Tamana City remain shut down, and TSMC's plant in Kikuyo Town also requires time for equipment adjustments. Kyushu, known as Silicon Island, is home to over 700 semiconductor-related facilities, raising concerns about the impact of supply disruptions on a wide range of industries.
時事通信·27dRead more ▾
7911.JP

Global flexible packaging market to reach $320.57 billion by 2031

The global flexible packaging market is projected to grow from an estimated $242 billion in 2025 to $320.57 billion by 2031, at a compound annual growth rate of 4.8 percent, according to a new report from ResearchAndMarkets.com. The bags and sacks segment currently leads with a 43 percent market share, while flexible paper is expected to grow at a CAGR of 4.73 percent. The Asia-Pacific region holds a 38 percent market share, driven by packaged food demand and e-commerce growth. Key industry developments include Amcor's merger with Berry Global in April 2025 and TOPPAN's $1.8 billion acquisition of Sonoco's Thermoformed & Flexibles Packaging business. Sustainability trends and shelf-life extension demands are driving adoption, though raw material price volatility remains a restraint.
GlobeNewswire·44dRead more ▾