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Telink Semiconductor (Shanghai) Co Ltd Ordinary Shares - Class A

Telink Semiconductor(Shanghai)Co.,Ltd. engages in research, development, design, and sales of low-power wireless IoT chips. The company also offers wireless communication chip products, such as low-power Bluetooth, dual-mode Bluetooth, Zigbee, Matter, WiFi, etc. Its products are used in computer peripherals, smart homes, smart hardware, smart industrial systems, smart business systems, and other fields. Telink Semiconductor(Shanghai)Co.,Ltd. was founded in 2010 and is based in Shanghai, China.

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Telink Semiconductor's 2026 interim net profit was 98.7388 million yuan, down 2.31% year-on-year

Telink Semiconductor released its 2026 interim report, with net profit attributable to the parent company of 98.7388 million yuan, a decrease of 2.31% compared with the same period last year. The company's total operating revenue was 541 million yuan, and net cash inflow from operating activities was 1.8689 million yuan, down 97.85% year-on-year. The latest asset-liability ratio was 6.37%, gross margin was 49.51%, ROE was 3.92%, and diluted earnings per share was 0.42 yuan.
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Telink Semiconductor's first-half net profit attributable to parent was 98.74 million yuan, down 2.3% year on year

Telink Semiconductor released its 2026 interim report. Operating revenue was 541 million yuan, up 7.4% year on year. Net profit attributable to the parent company was 98.74 million yuan, down 2.3% year on year. Net profit attributable to the parent after deducting non-recurring items was 27.91 million yuan, down 70.0% year on year. Net operating cash flow was 1.87 million yuan, down 97.9% year on year. Second-quarter operating revenue was 307 million yuan, up 12.2% year on year, and net profit attributable to the parent was 90.45 million yuan, up 38.4% year on year. The company continued to develop in the wireless Internet of Things chip sector, made progress in Bluetooth, Zigbee, Thread and other technology areas, and launched multiple chips supporting AI functions. Research and development expenses rose 38.85% year on year.
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Artificial Intelligence

Telink Semiconductor's first-half revenue hits 541 million yuan as edge AI chips ship in volume

Telink Semiconductor released its 2026 semi-annual report, achieving operating revenue of 541 million yuan, up 7.37 percent year on year. Net profit attributable to shareholders of the listed company was 98.7388 million yuan, roughly flat compared with the first half of last year. Net profit after excluding share-based payment expenses was 120 million yuan. Research and development expenses were 162 million yuan, and R&D spending as a share of operating revenue rose to 29.93 percent. The company's edge AI chips and RISC-V architecture products have entered the stage of large-scale shipments. The TL721X series edge AI chips have achieved mass production, and the TL322X SoC has entered the introduction stage with multiple leading international customers. Telink Semiconductor has also completed integrating its self-developed NPU into multiple upgraded products and plans to gradually roll them out to customers within 2026. In the automotive electronics sector, it has secured design wins with multiple manufacturers, and products in the medical field have entered mass production.
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Artificial Intelligence

Cambricon first-half net profit up 123% year-on-year

Cambricon released its 2026 half-year report, achieving operating revenue of 5.996 billion yuan, up 108.13% year-on-year, and net profit attributable to shareholders of the listed company of 2.311 billion yuan, up 122.61% year-on-year. The company said that demand in the AI computing power market is steadily rising, and it continues to deepen cooperation with leading enterprises in the finance and internet sectors by leveraging its core competitiveness in AI chips. As of the end of the period, prepayments stood at 2.914 billion yuan, up 291.37% year-on-year, and inventory book value was 8.248 billion yuan, up 66.83% year-on-year, accounting for 45.32% of total assets at period-end. In addition, SK Hynix announced it will build new wafer fabs in Yongin and Cheongju, South Korea, with a combined investment of about 54 trillion won, approximately 38.4 billion US dollars, to meet the growing demand for memory chips in the AI era. Biwin Storage's holding subsidiary Guangdong Xinchenghanqi plans to increase capital and expand shares by introducing external investors, with total financing in this round not exceeding 600 million yuan. Zhongjuxin's half-year 2026 net profit grew 72.75% year-on-year. Telink Semiconductor terminated the matter of issuing shares and paying cash to acquire 100% equity of Shanghai Panchip Microelectronics and raising supporting funds. ACM Research's first-half net profit rose 42.14% year-on-year. Focuslight Technologies plans a private placement to raise no more than 1.021 billion yuan for a high-end optical interconnect core optical component R&D and industrialization capacity building project. ST Hangtu and its actual controller Wang Yuxiang were placed on file by the CSRC for suspected illegal information disclosure. Aerospace Yuxing completed nearly 2 billion yuan in Series D financing, with its valuation exceeding 10 billion yuan, joining the ranks of commercial aerospace unicorns.
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Telink Semiconductor Terminates Acquisition of 100% Equity in Panchip Microelectronics

Telink Semiconductor announced the termination of its plan to acquire 100% equity in Shanghai Panchip Microelectronics Co., Ltd. through the issuance of shares and cash payment, along with the related fundraising. The company had originally intended to acquire all equity in Panchip Microelectronics via this method, and the transaction was not expected to constitute a major asset restructuring or backdoor listing. Telink Semiconductor stated that, given certain changes in the overall market environment compared to the initial planning stage, it has decided to terminate this transaction.
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Teamsun Technology Expects a Loss of 220 Million to 330 Million Yuan in the First Half of 2026

Teamsun Technology disclosed its earnings forecast, expecting a net loss attributable to the parent company of 220 million to 330 million yuan in the first half of 2026, compared with a profit of 140 million yuan in the same period last year. The company expects operating revenue of 2.5 billion yuan for the period, up 10.5 percent year on year, with its main business maintaining growth momentum. The swing from profit to loss was mainly due to non-operating factors, including an impairment provision of about 530 million yuan on the long-term equity investment in its subsidiary GDYN, as well as net losses from changes in the fair value of holdings such as Telink Semiconductor. Share-based payment expenses from the equity incentive plan also weighed on the results. In addition, non-recurring profit and loss for the first half is expected to be between 28 million and 42 million yuan, a sharp decline from 223 million yuan in the same period last year, mainly because a large fair value gain was recognized in the prior-year period while the current period turned to a loss.
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Huasheng Tiancheng Expects First-Half Loss of 220 Million to 330 Million Yuan

Huasheng Tiancheng issued an announcement, expecting a net loss attributable to the parent company of 220 million to 330 million yuan for the first half of 2026, compared with a profit of 140 million yuan in the same period last year. The company expects first-half operating revenue of about 2.5 billion yuan, up from 2.26 billion yuan a year earlier. The loss is mainly due to a decline in the share price of subsidiary Grid Dynamics Holdings, leading the company to make an impairment provision of about 530 million yuan on the related long-term equity investment, as well as net losses from changes in the fair value of financial assets caused by stock price fluctuations of secondary market holdings such as Telink Semiconductor. Additionally, share-based payment expenses accrued under the equity incentive plan also had a phased impact on net profit.
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